The Benefits of Enepig with Pure Pd for Gold Wire Bonding
نویسندگان
چکیده
As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows the benefits of using a pure palladium layer in ENEPIG and ENEP (Electroless Nickel / Electroless Palladium) surface finishes in terms of physical properties and in terms of gold wire bonding test results.
منابع مشابه
Gold wire bonding performance and reliability of ENEPIG surface finishes
INTRODUCTION The expression „multifunctional PCB“, as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques like, Al-wire bonding, Auwire bonding, conductive adhesives and other interconnection methods. In the mixed COB/SMT assembly, where ...
متن کاملCopper Wire Bonding on Pure Palladium Surface Finishes – Eliminating the Gold Cost from the Electronic Package
During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold applications. The most commonly used c...
متن کاملMore uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
The currently high price of gold wire has led to the development of bonding wire made from palladium-coated-copper as a lower cost alternative. Increasing the uniformity of the Pd distribution in free-air balls, formed by melting the wire end with an electric spark, is of interest as it can influence the uniformity of process and reliability. To study this Pd distribution, free-air balls are ma...
متن کاملComparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths ...
متن کاملEffects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wires with Various Pd and Au Contents
Ag-alloy bonding wires containing various Pd and Au elements and traditional 4 N Au and Pd-coated 4 N Cu bonding wires were stressed with a current density of 1.23 ˆ 105 A/cm2 in air. The amounts of annealing twins in the Ag-alloy wires were much higher than those in Au and Pd-coated Cu wires. The percentages of twinned grains in these Ag-alloy wires increased obviously with current stressing. ...
متن کامل